projects

Shipped in production.

Named commercial chips our work went into — the public subset. Most of our work is covered by NDA; named references are available on request.

in production

Tape-outs in customer products.

Named commercial chips our work shipped in — sensor ICs, power management, and functional-safety processor IP. Most are still on customer datasheets.

// contributions span rtl, dv, dsp, soc integration, and sign-off across multiple tape-outs

// under NDA

Most of our work is covered by NDA.

The chips above are the public subset. Named references for BSP, platform security, Common Criteria evaluation, SoC architecture, and wireless PHY work are available on request once an NDA is in place.